X-ray microdiffraction study of Cu interconnects
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Zhang, Xueyuan
Solak, Harun H.
Cerrina, Francesco
Lai, Barry
Cai, Zhonghou
Ilinski, Peter
Legnini, Daniel G.
Rodrigues, William
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http://dx.doi.org/10.1063/1.125731
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American Institute of Physics Inc
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The following article appeared in Zhang, X., Solak, H., Cerrina, F., Lai, B., Cai, Z., Ilinski, P., et al. (2000). X Ray Microdiffraction Study Of Cu Interconnects. Applied Physics Letters, 76(3), 315-317. and may be found at http://link.aip.org/link/?apl/76/315