Heterogeneous integration: From substrate technology to active packaging

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dc.contributor.authorBrown, April S.en_US
dc.contributor.authorJokerst, Nan Marieen_US
dc.contributor.authorDoolittle, Alanen_US
dc.contributor.authorBrooke, Martinen_US
dc.contributor.authorKuech, Thomas F.en_US
dc.contributor.authorSeo, Sang-Wooen_US
dc.contributor.authorKang, Sangbeomen_US
dc.contributor.authorHuang, Saen_US
dc.contributor.authorShen, Jeng-Jungen_US
dc.date.accessioned2007-07-13T19:29:39Z
dc.date.available2007-07-13T19:29:39Z
dc.date.issued2001en_US
dc.descriptionThis material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en_US
dc.format.extent313393 bytes
dc.format.mimetypeapplication/pdfen_US
dc.format.mimetypeapplication/pdf
dc.identifier.citationBrown, A. S., Nan, J. Marie, D., Alan, B., Martin, K., Thomas F., Seo, S.W., et al. (2001). Heterogeneous integration: From substrate technology to active packaging. In IEEE International Electron Devices Meeting IEDM 2001, Dec 2-5 2001, , 197-200.en_US
dc.identifier.doihttp://dx.doi.org/10.1109/IEDM.2001.979465en_US
dc.identifier.urihttp://digital.library.wisc.edu/1793/10620
dc.publisherInstitute of Electrical and Electronics Engineers Incen_US
dc.relation.ispartofhttp://www.ieee.org/en_US
dc.relation.ispartofhttp://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000245en_US
dc.rightsCopyright 2001 Institute of Electrical and Electronics Engineersen_US
dc.rights©20xx IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_US
dc.titleHeterogeneous integration: From substrate technology to active packagingen_US

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