Influence of nickel substrate grain structure on YBa2Cu3O7-x supercurrent connectivity in deformation-textured coated conductors
Loading...
Files
Date
Authors
Feldmann, D. Matthew
Reeves, Jodi L.
Polyanskii, Anatoli
Kozlowski, Gregory
Biggers, Rand R.
Nekkanti, Robert M.
Maartense, Iman
Tomsic, Michael
Barnes, Paul N.
Oberly, Charles E.
Advisors
License
DOI
http://dx.doi.org/10.1063/1.1315631
Type
Journal Title
Journal ISSN
Volume Title
Publisher
American Institute of Physics
Grantor
Abstract
Description
This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Keywords
Related Material and Data
Citation
The following article appeared in Feldmann, D.M., Reeves, J.L., Polyanskii, A.A., Kozlowski, G., Biggers, R.R., Nekkanti, R.M., et al. (2000). Influence Of Nickel Substrate Grain Structure On Y Ba2 Cu3 O7 X Supercurrent Connectivity In Deformation Textured Coated Conductors. Applied Physics Letters, 77(18), 2906-8. and may be found at http://link.aip.org/link/?apl/77/2906