Grain boundary sliding in surface mount solders during thermal cycling
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Lee, Seong-Min
Stone, Donald S.
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Publ by IEEE, Piscataway, NJ, USA
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Lee, S.M., & Stone, D. S. (1990). Grain boundary sliding in surface mount solders during thermal cycling. In 1990 Proceedings of the 40th Electronic Components and Technology Conference, May 20-23 1990, 1, 491-495.