A shell model for the filament structure of Bi-2223 conductors
Loading...
Files
Date
Authors
Holesinger, Terry G.
Kennison, Jack A.
Liao, Shaolin
Yuan, Yongwen
Jiang, Jianyi
Cai, Xueyu
Hellstrom, Eric E.
Larbalestier, David C.
Baurceanu, Ruxandra M.
Maroni, Victor A.
Advisors
License
DOI
Type
Journal Title
Journal ISSN
Volume Title
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Grantor
Abstract
Description
This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Keywords
Related Material and Data
Citation
Holesinger, T.G., Kennison, J.A., Liao, S., Yuan, Y., Jiang, J., Cai, X.Y., et al. (2005). A Shell Model For The Filament Structure Of Bi 2223 Conductors. Ieee Transactions On Applied Superconductivity, 15(2), 2514-2517.