Magnetic-field-enhanced rf argon plasma for ionized sputtering of copper
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Wang, Weitung
Foster, John
Wendt, Amy E.
Booske, John H.
Onuoha, Tina
Sandstrom, Perry W.
Liu, Henley L.
Gearhart, Steven S.
Hershkowitz, Noah
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American Institute of Physics
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The following article appeared in Wang, W., Foster, J., Wendt, A.E., Booske, J.H., Onuoha, T., Sandstrom, P.W., et al. (1997). Magnetic Field Enhanced Rf Argon Plasma For Ionized Sputtering Of Copper. Applied Physics Letters, 71(12), 1622-1624. and may be found at http://link.aip.org/link/?apl/71/1622