Magnetic-field-enhanced rf argon plasma for ionized sputtering of copper

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dc.contributor.authorWang, Weitungen_US
dc.contributor.authorFoster, Johnen_US
dc.contributor.authorWendt, Amy E.en_US
dc.contributor.authorBooske, John H.en_US
dc.contributor.authorOnuoha, Tinaen_US
dc.contributor.authorSandstrom, Perry W.en_US
dc.contributor.authorLiu, Henley L.en_US
dc.contributor.authorGearhart, Steven S.en_US
dc.contributor.authorHershkowitz, Noahen_US
dc.date.accessioned2007-07-13T19:32:05Z
dc.date.available2007-07-13T19:32:05Z
dc.date.issued1997en_US
dc.descriptionThis material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en_US
dc.format.extent57337 bytes
dc.format.mimetypeapplication/pdfen_US
dc.format.mimetypeapplication/pdf
dc.identifier.citationThe following article appeared in Wang, W., Foster, J., Wendt, A.E., Booske, J.H., Onuoha, T., Sandstrom, P.W., et al. (1997). Magnetic Field Enhanced Rf Argon Plasma For Ionized Sputtering Of Copper. Applied Physics Letters, 71(12), 1622-1624. and may be found at http://link.aip.org/link/?apl/71/1622en_US
dc.identifier.urihttp://digital.library.wisc.edu/1793/10944
dc.publisherAmerican Institute of Physicsen_US
dc.relation.ispartofhttp://www.aip.orgen_US
dc.relation.ispartofhttp://apl.aip.org/en_US
dc.rightsCopyright 1997 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.en_US
dc.titleMagnetic-field-enhanced rf argon plasma for ionized sputtering of copperen_US

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