Stress and Deformation Analysis at the Micro-Scale

Abstract

Improving the structural integrity of microstructured materials relies on the combination of advancements in modeling capability and spatially resolved experimental characterization of deformation and damage. We report the recent advancements in the use of synchrotron X-ray diffraction techniques, as well as in the methods utilizing micro-scale material removal in combination with scanning electron microscopy and digital image correlation for relief strain measurement and stress evaluation.