Stress and Deformation Analysis at the Micro-Scale

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dc.contributor.authorKorsunsky, Alexander M.
dc.date.accessioned2014-04-21T16:36:02Z
dc.date.available2014-04-21T16:36:02Z
dc.date.issued2014-03-25
dc.description.abstractImproving the structural integrity of microstructured materials relies on the combination of advancements in modeling capability and spatially resolved experimental characterization of deformation and damage. We report the recent advancements in the use of synchrotron X-ray diffraction techniques, as well as in the methods utilizing micro-scale material removal in combination with scanning electron microscopy and digital image correlation for relief strain measurement and stress evaluation.en
dc.identifier.citationICOMM 2014 No. 88en
dc.identifier.urihttp://digital.library.wisc.edu/1793/68780
dc.publisher9th International Conference on MicroManufacturing (ICOMM 2014)en
dc.subjectdigital image correlationen
dc.subjectresidual stressen
dc.subjectdiffractionen
dc.subjectx-rayen
dc.subjectfocused ion beamen
dc.subjectelectron microscopyen
dc.titleStress and Deformation Analysis at the Micro-Scaleen
dc.typeConference paperen

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